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Volumn 21, Issue 5, 2005, Pages 2000-2007

Simulation and investigation of factors affecting high aspect ratio UV embossing

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; COMPUTER SIMULATION; CROSSLINKING; FRACTURE TESTING; INTERFACES (MATERIALS); MICROOPTICS; POLYMERS; SHRINKAGE; ULTRAVIOLET RADIATION;

EID: 14844322916     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la035124e     Document Type: Article
Times cited : (32)

References (25)
  • 23
    • 14844312793 scopus 로고    scopus 로고
    • note
    • 2 [ref 22], but this value is reduced by 1/1000 for a weak mold-embossing interface.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.