Electrical failure analysis of Au nanowires

IEEE Transactions on Nanotechnology

Volumn 7, Issue 6, 2008, Pages 688-692

  Huang, Qiaojian ^a   Lilley, Carmen M ^a   Divan, Ralu ^b   Bode, Matthias ^b  

^a University of Illinois at Chicago   (United States)

^b ARGONNE NATIONAL LABORATORY   (United States)

Author keywords

Electrical properties; Electromigration; Failure mechanism; Nanowires

Indexed keywords

ACTIVATION ENERGY; ELECTRIC NETWORK ANALYSIS; ELECTRIC PROPERTIES; ELECTRIC WIRE; ELECTROMIGRATION; ELECTRON BEAMS; GOLD; NANOWIRES; QUALITY ASSURANCE; RELIABILITY; SAFETY FACTOR;

AU FILMS; AU NANOWIRES; BEAM EVAPORATIONS; ELECTRICAL FAILURES; ELECTRICAL PROPERTIES; FAILURE CURRENTS; FAILURE MECHANISM; IN-SITU; SURFACE EFFECTS;

FAILURE ANALYSIS;

EID: 58149260339     PISSN: 1536125X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNANO.2008.2006166     Document Type: Article

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