Texture evolution in Cu films and lines

Materials Research Society Symposium Proceedings

Volumn 990, Issue , 2007, Pages 183-189

  Chung, Chia Jeng ^a   Field, David ^b   Park, No Jin ^c   Woo, Christy ^d  

^a Washington State University   (United States)

^b WASHINGTON STATE UNIVERSITY   (United States)

^c Kumoh National Institute of Technology   (South Korea)

^d ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 41549093349     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0990-b08-23     Document Type: Conference Paper

References (10)

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5. N.-J. Park, D. P. Field, Scripta Materialia 54 (2006) 999-1003
6. Sundquist BE., Acta Metall, 1964;12:67
7. Mclean M., Acta Metall, 1971;19:387
8. L. E. Murr, Interfacial Phenomena in Metals and Alloys, London: Addison-Wesley, 1975
9. Milton Ohring, Materials Science of Thin Films - Deposition & Structure, second edition, Wiley and Sons, New York, 1999.
10. F. J. Humphreys, M. Hatherly, Recrystallization and Related Annealing Phenomena