Predicting thickness dependent twin boundary formation in sputtered Cu films

Scripta Materialia

Volumn 54, Issue 6, 2006, Pages 999-1003

  Park, N J ^a,b   Field, D P ^b  

^a Kumoh National Institute of Technology   (South Korea)

^b Washington State University   (United States)

Author keywords

Copper films; Electron backscatter diffraction (EBSD); Texture; Twin boundaries

Indexed keywords

ANNEALING; COPPER; MICROSTRUCTURE; TEXTURES; THIN FILMS;

COPPER FILMS; ELECTRON BACKSCATTER DIFFRACTION (EBSD); FILM THICKNESS; TWIN BOUNDARIES;

GRAIN BOUNDARIES;

EID: 30744437185     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2005.11.041     Document Type: Article

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