Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface

Microelectronics Reliability

Volumn 44, Issue 6, 2004, Pages 993-1007

  Turunen, Markus P K ^a   Marjamäki, Pekka ^a   Paajanen, Matti ^a   Lahtinen, Jouko ^a   Kivilahti, Jorma K ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DIELECTRIC MATERIALS; ELECTRIC FIELD EFFECTS; FINITE ELEMENT METHOD; METALLIZING; OPTIMIZATION; SCANNING ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

ENVIRONMENTAL STRESSES; EPOXY INTERFACES; FRACTURE SURFACES; INTERFACIAL ADHESION;

PRINTED CIRCUIT BOARDS;

EID: 2442442212     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.01.001     Document Type: Article

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