The proposal of all-wet fabrication process for ulsi interconnects technologies - Application of electroless NiB deposition to capping and barrier layers

Proceedings - Electrochemical Society

Volumn 10, Issue , 2003, Pages 137-145

  Yoshino, Masahiro ^a   Nonaka, Yuichi ^a   Yokoshima, Tokihiko ^b   Osaka, Tetsuya ^a,b,c  

^a Grad Sch of Sci and Engineering   (Japan)

^b Advanced Research Institute for Science and Engineering   (Japan)

^c WASEDA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALL-WET FABRICATION; CAPPING; INTERCONNECT TECHNOLOGIES; WIRING PROCESS;

ADHESION; DEPOSITION; DIFFUSION; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; ELECTROMIGRATION; HEAT TREATMENT; MONOLAYERS; SILICA; THIN FILMS;

ULSI CIRCUITS;

EID: 5744249147     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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