Thermal study of high-power nitride-based flip-chip light-emitting diodes

IEEE Transactions on Electron Devices

Volumn 55, Issue 12, 2008, Pages 3375-3382

  Fan, Bingfeng ^a   Wu, Hao ^a   Zhao, Yu ^a   Xian, Yulun ^a   Zhang, Baijun ^a   Wang, Gang ^a  

^a SUN YAT SEN UNIVERSITY   (China)

Author keywords

Finite element model (FEM) modeling; Infrared (IR) microscopy; Light emitting diodes (LEDs); Nitride based flip chip(FC); Temperature testing

Indexed keywords

BONDING; DIODES; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HOT WORKING; NITRIDES; NUMERICAL MODELS;

CONFIGURATION DESIGNS; FINITE-ELEMENT MODEL MODELING; INFRARED MICROSCOPY; NITRIDE BASED FLIP CHIPS; PARAMETRIC -ANALYSIS; TEMPERATURE TESTING; THERMAL DEPENDENCES; THERMAL PERFORMANCE;

LIGHT EMITTING DIODES;

EID: 57149146046     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2008.2006534     Document Type: Article

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