Study of phosphor thermal-isolated packaging technologies for high-power white light-emitting diodes

IEEE Photonics Technology Letters

Volumn 19, Issue 11, 2007, Pages 1121-1123

  Fan, Bingfeng ^a   Wu, Hao ^a   Zhao, Yu ^a   Xian, Yulun ^a   Wang, Gang ^a  

^a SUN YAT SEN UNIVERSITY   (China)

Author keywords

Finite element method (FEM) simulation; Packaging configuration; Thermal isolation; White light emitting diode (LED)

Indexed keywords

A-THERMAL; COATING LAYER; COLOR CHARACTERISTICS; ENCAPSULANTS; FINITE-ELEMENT METHOD (FEM) SIMULATION; GAN BASED LED; HIGH CURRENTS; HIGH-POWER; LED CHIPS; OPERATING CONDITION; PACKAGING TECHNOLOGIES; POWER PERFORMANCE; SIMULATION RESULT; SURFACE TEMPERATURES; THERMAL MANAGEMENT; WHITE LED; WHITE LIGHT EMITTING DIODES;

CHIP SCALE PACKAGES; COATINGS; DIODES; FINITE ELEMENT METHOD; GALLIUM ALLOYS; GALLIUM NITRIDE; LIGHT EMISSION; PACKAGING; PHOSPHORS;

LIGHT EMITTING DIODES;

EID: 57149141407     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2007.901098     Document Type: Article

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