Failure criteria of flip chip joints during accelerated testing

Microelectronics Reliability

Volumn 42, Issue 12, 2002, Pages 1921-1930

  Stepniak, Frank ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; ELECTRIC RESISTANCE; ELECTRONIC EQUIPMENT TESTING; FAILURE ANALYSIS; SAMPLING; SENSITIVITY ANALYSIS; SOLDERED JOINTS; THERMAL CYCLING;

CRACKED JOINTS;

FLIP CHIP DEVICES;

EID: 0036890557     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00121-X     Document Type: Article

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