Investigation of conductive polymer flip chip attachment in multichip module applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1995, Pages 1244-1249

  Howard, Chris ^a   Nair, Suja ^a   Ang, Simon ^a   Schaper, Leonard ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE PLASTICS; MULTICHIP MODULES; RELIABILITY; SILVER;

CONDUCTIVE POLYMER FLIP CHIP ATTACHMENT;

FLIP CHIP DEVICES;

EID: 0029229659     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)