SCOPUS 정보 검색 플랫폼

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 24, Issue 4, 2001, Pages 261-268

Flip chip interconnect systems using copper wire stud bump and lead free solder

(4) Zama, Satoru a,b Baldwin, Daniel F b Hikami, Toshiya a Murata, Hideaki a

b GEORGIA INSTITUTE OF TECHNOLOGY (United States)

Author keywords

Compression bonding; Copper; Flip chip; Interconnection; Intermetallic compound; Lead free solders; Solder; Stud bump; Wire bonding; Wire bumping

Indexed keywords

COPPER; DELAMINATION; DIFFUSION IN SOLIDS; EUTECTICS; INTERMETALLICS; PRINTED CIRCUIT BOARDS; SOLDERING; SOLDERING ALLOYS; ULTRASONIC APPLICATIONS; WIRE;

DIRECT CHIP ATTACHMENT (DCA) PROCESSES; STUD BUMP;

FLIP CHIP DEVICES;

EID: 0035493706 PISSN: 1521334X EISSN: None Source Type: Journal
DOI: 10.1109/6104.980034 Document Type: Article

Times cited : (23)

References (11)

1
- 0002858858
- Anisotropic conductive flip chip-on-glass technology
- J. H. Lau, Ed. New York: McGraw-Hill
- (1995) Flipchip Technology , pp. 317-339
- Lee, C.H.¹

2
- 0008163049
- Flip chip mounting using stud bumps and adhesive for encapsulation
- J. H. Lau et al., Ed. New York: McGraw-Hill
- (1995) Flipchip Technology , pp. 357-366
- Tsunoi, K.¹

3
- 0008245504
- New stud bumping technology using copper wire
- San Jose, CA
- (1997) Proc. Surface Mount Int. Conf. , pp. 273-277
- Kaga, Y.¹

4
- 0008162872
- A stud bumping technology using copper wire
- Braselton, GA, Mar.
- (1998) Proc. Adv. Technol. Workshop Flip Chip Technol.
- Zama, S.¹

5
- 0030647010
- Fine pitch printing of Sn/Pb and lead free solders for flip chip technology
- Seattle, WA
- (1997) Proc. Electron. Comp. Technol. Conf. , pp. 254-264
- Kloeser, J.¹

6
- 0032657596
- Pb-free solder alloys for flip chip applications
- San Diego, CA
- (1999) Proc. Electron. Comp. Technol. Conf. , pp. 283-288
- Kang, S.K.¹ Horkans, J.² Andricacos, P.C.³ Carruthers, R.A.⁴ Cotte, J.⁵ Datta, M.⁶ Gruber, P.⁷ Harper, J.M.E.⁸ Kwietniak, K.⁹ Sambucetti, C.¹⁰ Shi, L.¹¹ Brouillette, G.¹² Danovitch, D.¹³

7
- 0032688683
- Recent advances in flip chip wafer bumping using solder paste technology
- San Diego, CA
- (1999) Proc. Electron. Comp. Technol. Conf. , pp. 260-265
- Elenius, P.¹ Leal, J.² Ney, J.³ Stepniak, D.⁴ Yeh, S.⁵

8
- 0034480250
- Microstructural coarsening of lead free solder joints during thermal cycling
- Las Vegas, NV
- (2000) Proc. Electron. Comp. Technol. Conf. , pp. 134-137
- Ye, L.-L.¹ Lai, Z.² Liu, J.³ Thölpn, A.⁴

9
- 0003481317
- New York: McGraw-Hill
- (1996) Modern Solder Technology for Comprehensive Electronics Manufacturing
- Hwang, J.S.¹

10
- 0034476455
- Development of conductive adhesives for solder replacement
- Dec.
- (2000) IEEE Trans. Comp. Packag. Technol. , vol.23 , pp. 620-626
- Lu, D.¹ Wong, C.P.²

11
- 0034275050
- A study of contact resistance of conductive adhesives based on anhydride-cured epoxy systems
- Sept.
- (2000) IEEE Trans. Comp. Packag. Technol. , vol.23 , pp. 440-446

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