High performance coreless flip-chip BGA packaging technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1765-1768

  Chang, David ^a   Wang, Y P ^a   Hsiao, C S ^a  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SOFTWARE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HIGH TEMPERATURE EFFECTS; INSERTION LOSSES;

BUMP STRESS; ELECTRICAL PERFORMANCES; FLIP CHIP BGA PACKAGING; RETURN LOSS;

FLIP CHIP DEVICES;

EID: 35348892557     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374035     Document Type: Conference Paper

References (2)

1. Desmond Y.R. Chong*, B.K. Lim, Kenneth J. Rebibis, S.J. Pan, Krishnamoortlii S."Development of a New Improved High Performance Flip Chip BGA Package," Proc 2004 Electronic Components and Technology Conf.
2. Yasutoshi Iwata, Masaharu Hotehama. "A New Density Organic Laminate for High Pin-Count Flip Chip Packages," Proc 2002 Electronic Components and Technology Conf.