A fast mechanical test technique for life time estimation of micro-joints

Microelectronics Reliability

Volumn 48, Issue 11-12, 2008, Pages 1822-1830

  Khatibi, G ^a   Wroczewski, W ^a   Weiss, B ^a   Licht, T ^b  

^a UNIVERSITY OF VIENNA   (Austria)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FATIGUE TESTING; INSTRUMENTS; MECHANICAL ENGINEERING; MECHANISMS; QUALITY ASSURANCE; SAFETY FACTOR; STEEL BRIDGES; TESTING; ULTRASONIC APPLICATIONS; WIRE;

BOND FAILURES; BOND WIRES; BONDING PROCESSES; ELECTRONIC DEVICES; ELECTRONIC PACKAGING; EXPERIMENTAL SET-UP; FAILURE MECHANISMS; FAILURE SURFACES; FATIGUE LIFE CURVES; HIGH FREQUENCIES; INTER-CONNECTS; LASER DOPPLER VIBROMETER; LIFE TIMES; LOADING CYCLES; MECHANICAL TESTING METHODS; POWER CYCLING; RELIABILITY ASSESSMENTS; SCREENING TOOLS; SHEAR LOADINGS; SIGNIFICANT REDUCTIONS; TESTING TIMES; TIME CONSUMING; ULTRASONIC RESONANCES;

MECHANICAL TESTING;

EID: 55649086616     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.09.003     Document Type: Article

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