Advanced IGBT modules for railway traction applications: Reliability testing

Microelectronics Reliability

Volumn 38, Issue 6-8, 1998, Pages 1319-1323

  Berg, H ^a   Wolfgang, E ^b  

^a Eupec GmbH   (Germany)

^b SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RAILROADS; ELECTRIC TRACTION; GATES (TRANSISTOR); RELIABILITY; SEMICONDUCTOR DEVICE TESTING; THERMAL CYCLING; THERMOANALYSIS;

ACCELERATED POWER CYCLING; INSULATED GATE BIPOLAR TRANSISTORS (IGBT);

BIPOLAR TRANSISTORS;

EID: 0032083762     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(98)00150-4     Document Type: Article

References (16)

1. LESIT (Leistungelektronik; Systemtechnik, Informationstechnologie): Swiss Federal Research Project (1993-1995)
2. Brite EuRam BE 95-2105 RAPSDRA: Reliability of Advanced Power Semiconductors for Railway Traction Applications
3. Zehringer, R.; Struck, A.; Lange, T.: Material Requirements for High Voltage, High Power IGBT devices, MRS Symposium Proceedings Nol. 483, (1998), pp. 369-380
4. Jacob, P.; Held, M.; Scacco, P.; Wu, W.: Reliability Testing and Analysis of IGBT-Power Semiconductor Modules, Proc. 20st ISTFA, (1994)
5. Malberti, P.; Ciappa, M.; Cattomio, R.: A Power-Cycling-Induced Failure Mechanism of IGBT Multichip Modules
6. Wu, W.; Held, M.; Jacob, P.; Scacco, P.; Birolini, A.: Investigation on the Long Term Reliability of Power IGBT Modules, Proc. ISPSD 95 (1995), pp. 443-448
7. Poech, M.-H..; Dittmer, KJ.; Gäbisch, D.: Investigations on the Damage Mechanism of Aluminium Wire Bonds Used for High Power Applications, Proc. EUPAC 96 (1996), pp. 128-131
8. Held, M.; Jacob, P.; Nicoletti, G.; Scacco, P.; Poech, M.-H.: Fast Power Cycling Test for IGBT Modules in Traction Application, Proc. PEDS 97 (1997), pp. 425-430
9. Auerbach, F.: Power-Cycling-Stability of IGBT-Modules. Proc. IEEE IAS, New Orleans, October 5-9 (1997)
10. Sommer, K.H.; Spanke, R.; Lefranc, G.; Göttert, J.: Multichip High Power IGBT-Modules for Traction and Industrial Application, Proc. EPE' 97, Trondheim, Norway, September 22-24, pp. 512-515
11. Hamidi, A.; Coquery, G.; Lallemand, R.: Reliability of High Power IGBT- Modules Testing on Thermal Fatigue Effects due to Traction Cycles: Proc. EPE '97, Trondheim
12. Hamidi, A.; Coquery, G.; Lallemand, R.; Vales, P.; Dorkel, J.M.: Temperature Measurements and Thermal Modeling of High Power IGBT Multichip Modules for Reliability Investigations in Traction Applications (this proceedings)
13. Cova, P.; Fantini, F.: On the Effect of Power Cycling Stress on IGBT Modules (this proceedings)
14. Ramminger, S.; Türkes, P.; Wachuta, G.; Crack Mechanism in Wire Bonding Joints (this proceedings)
15. Herr, E.; Frey, T.; Schlegel, R.; Stuck, A.; Zehringer, R.: Substrate-To-Base Solder Joint Reliability in High Power IGBT Modules, Microelectronics and Reliability, Special Issue ESREF 97 (1997), pp. 1719-1722
16. Crook, D.L.: Evolution of VLSI Reliability Engineering. Proc. of IRPS 1990, pp. 2-11 Brite EuRam BE 95-2105 RAPSDRA: Reliability of Advanced Power Semiconductors for Railway Traction Applications