Experimental study and life prediction on high cycle vibration fatigue in BGA packages

Microelectronics Reliability

Volumn 46, Issue 7, 2006, Pages 1128-1138

  Liu, Xia ^a   Sooklal, Valmiki K ^a   Verges, Melody A ^b   Larson, Michael C ^a  

^a Tulane University   (United States)

^b UNO College of Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; FATIGUE OF MATERIALS; FRACTURE MECHANICS; LIFE CYCLE; SOLDERING ALLOYS; VIBRATIONS (MECHANICAL);

BALL GRID ARRAY (BGA) PACKAGES; CYCLES-TO-FAILURE; SOLDER INTERCONNECTS; VIBRATION TESTING;

ELECTRONICS PACKAGING;

EID: 33646352722     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.09.011     Document Type: Article

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