Tutorial: Temperature as an input to microelectronics-reliability models

IEEE Transactions on Reliability

Volumn 45, Issue 1, 1996, Pages 3-9

  Lall, Pradeep ^a  

^a MOTOROLA INC   (United States)

Author keywords

Activation energy; Failure rate; Mean time to failure; Reliability modeling; Temperature

Indexed keywords

ACTIVATION ENERGY; FAILURE ANALYSIS; MATHEMATICAL MODELS; RELIABILITY; TEMPERATURE;

MICROELECTRONIC DEVICE FAILURES; TEMPERATURE ACCELERATION;

MICROELECTRONICS;

EID: 0030109952     PISSN: 00189529     EISSN: None     Source Type: Journal    
DOI: 10.1109/24.488908     Document Type: Article

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