Hierarchical modeling of creep behavior of SnAg solder alloys

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 273-277

  Pei, Min ^a   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HIERARCHICAL MODELING; MODEL PREDICTIONS;

CREEP; EUTECTICS; MATHEMATICAL MODELS; MICROSTRUCTURE; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 35348883588     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373809     Document Type: Conference Paper

References (13)

1. Chen, Z.U., Shi, Y.W.; Xia, Z.D.; Yan, Y.F., "Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints", Journal of Electronic Materials, v 31, n 10 SPEC.(2002), p 1122-1128
2. Dutta, I., "A constitutive model for creep of lead-free solders undergoing strain-enhanced microstructural coarsening: A first report", Journal of Electronic Materials, v 32, n 4(2003), p 201-207
3. Pei, M., Qu, J. "Effect of Rare Earth Elements on Lead-Free Solder Microstructure Evolution", ECTC 2007, accepted.
4. Pei, M., Qu, J. "Creep Property of Lead-Free Solders with Rare Earth Element", in preparation.
5. Breen, J. E., Weertman, J. "Creep of Polycrystalline Tin." Journal of Metals 203(1955) pp. 1230-1234.
6. Weertman. J., B., J.E. "Creep of Tin Single Crystals." Journal of Applied Physics 27,10(1956) pp.1189-1193.
7. Suh, S. H., Cohen, J.B., Weertman, J. . "X-Ray Diffraction Study of Subgrain Misorientation during High Temperature Creep of Tin Single Crystals." Metallurgical Transactions A 14A(1)(1983) pp. 117-126.
8. Gao, F., Takemoto, T., "Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation", Materials Letters 60 (2006) pp. 2315-2318
9. Gao, F., Takemoto, T., "The Evolution of Plastic Deformation of Sn3.5Ag-Based Lead-Free Solders", ECTC 2006, pp.269-274
10. http://www.metallurgy.nist.gov/phase/solder/agsn.html, as of Dec. 2006
11. Qu, J., Cherkaoui, M. Fundamentals of Micromechanics of Solids, John Wiley & Sons, Inc., Hoboken, New Jersey, 2006
12. http://www.ctcms.nist.gov/oof/oof2/, Aug. 2006
13. Pei, M, Ph.D. Dissertation, Georgia Institutive of Technology, March, 2007