Plasma enhanced chemical vapor deposition of thermally stable and low-dielectric-constant fluorinated amorphous carbon films using low-global-warming-potential gas C5F8

Thin Solid Films

Volumn 374, Issue 2, 2000, Pages 256-261

  Shirafuji, Tatsuru ^a   Kamisawa, Akira ^b   Shimasaki, Takaaki ^b   Hayashi, Yasuaki ^a   Nishino, Shigehiro ^a  

^a KYOTO INSTITUTE OF TECHNOLOGY   (Japan)

^b ROHM CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; FILM GROWTH; FLUOROCARBONS; GLOBAL WARMING; HEAT TREATMENT; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SUBSTRATES; THERMODYNAMIC STABILITY;

INTER-METAL DIELECTRICS; LOW-DIELECTRIC CONSTANT;

AMORPHOUS FILMS;

EID: 0034291666     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(00)01159-7     Document Type: Article

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