Bond pad cratering study by reliability tests

Journal of Materials Science: Materials in Electronics

Volumn 13, Issue 5, 2002, Pages 309-314

  Tan, C W ^a,b   Daud, A R ^a  

^a UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

^b ON Semiconductor SCG Industries M Sdn Bhd Malaysia   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; BONDING; COPPER; ETCHING; INTERFACES (MATERIALS); MICROCRACKS; RELIABILITY; SEMICONDUCTING SILICON; SUBSTRATES; THERMAL CYCLING; WIRE;

THERMOSONIC BONDING;

ELECTRONICS PACKAGING;

EID: 0036576093     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1015580227090     Document Type: Article

References (13)