TEM specimen preparation of semiconductor-PMMA-metal interfaces

Materials Characterization

Volumn 59, Issue 11, 2008, Pages 1623-1629

  Thangadurai, P ^a   Lumelsky, Yulia ^a   Silverstein, Michael S ^a   Kaplan, Wayne D ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

EELS; FIB; Interfaces; PMMA; TEM

Indexed keywords

COPPER; ENERGY DISSIPATION; FOCUSED ION BEAMS; GOLD; ION BOMBARDMENT; MICROSCOPIC EXAMINATION; MULTILAYER FILMS; PLASMONS; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SPECIMEN PREPARATION; THICK FILMS; WATER POLLUTION;

EELS; FIB; INTERFACES; PMMA; TEM;

FILM PREPARATION;

EID: 51649125442     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2008.02.007     Document Type: Article

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