An evaluation of gold and copper wire bonds on shear and pull testing

Journal of Electronic Packaging

Volumn 128, Issue 3, 2006, Pages 192-201

  Murali, S ^a   Srikanth, N ^a   Vath III, Charles J ^a  

^a ASM Technology Singapore   (Singapore)

Author keywords

Copper ball bond; Gold ball bond; Interface; Shear fracture; Thermosonic bonding

Indexed keywords

COPPER; GOLD; INTERFACES (MATERIALS); METALLIZING; PLASTIC DEFORMATION; SHEAR STRENGTH; TENSILE TESTING;

COPPER BALL BOND; GOLD BALL BOND; SHEAR FRACTURE; THERMOSONIC BONDING;

MICROELECTRONICS;

EID: 33750313673     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2229214     Document Type: Article

References (8)

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