Effect of Pt addition on growth stress and thermal stress of NiSi films

Journal of Applied Physics

Volumn 104, Issue 5, 2008, Pages

  Van Bockstael, C ^a   De Keyser, K ^a   Deduytsche, D ^a   Van Meirhaeghe, R L ^a   Detavernier, C ^a   Jordan Sweet, J L ^b   Lavoie, C ^b  

^a GHENT UNIVERSITY   (Belgium)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING ELEMENTS; ECOLOGY; NICKEL; NICKEL ALLOYS; PLATINUM; PLATINUM ALLOYS; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SILICON ALLOYS; STRENGTH OF MATERIALS; THERMAL STRESS; THERMOELASTICITY;

AS-DEPOSITED; CAPPING LAYER; CURVATURE MEASUREMENTS; EPITAXIAL ORIENTATIONS; FILM STRESSES; GROWTH STRESSES; IN-SITU; IN-SITU XRD; NISI FILMS; PHASE SEQUENCES; POLE FIGURE MEASUREMENTS; ROOM TEMPERATURES; SILICIDATION TEMPERATURE; SOLID-STATE REACTIONS; STRESS-RELAXATION;

MOLECULAR BEAM EPITAXY;

EID: 51849111901     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2973679     Document Type: Article

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