In situ study of stress evolution during the reaction of a nickel film with a silicon substrate

Microelectronic Engineering

Volumn 76, Issue 1-4, 2004, Pages 318-323

  Rivero, Christian ^a   Gergaud, Patrice ^a   Thomas, Olivier ^a   Froment, Benoit ^b   Jaouen, Hervé ^b  

^a CNRS   (France)

^b STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; MAGNETRON SPUTTERING; PHASE DIAGRAMS; POISSON EQUATION; SILICON; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

METAL-SILICON REACTIONS; RAMP HEATING; SILICIDE FORMATION; WAFER CURVATURE;

NICKEL;

EID: 4544225605     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.07.032     Document Type: Conference Paper

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