Electrodeposition of indium for bump bonding

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 2096-2100

  Yingtao, Tian ^a   Changqing, Liu ^a   Hurt, David ^a   Stevens, Bob ^b  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b RUTHERFORD APPLETON LABORATORY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC COMPONENTS; HIGH-DENSITY INTERCONNECTIONS; HYBRID PIXEL DETECTORS; PACKAGING DENSITIES;

INDIUM;

EID: 51349158904     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550274     Document Type: Conference Paper

References (16)

1. E. Cabraja, M. Bigas et al. Special bump bonding technique for silicon pixel detectors, Nucl. Instr. and Meth. A 576 (2007) 150-153.
2. M. Bigas, E. Cabraja, M. Lozano. Bonding techniques for hybrid active pixel sensors (HAPS), Nucl. Instr. and Meth. A 574 (2007) 392-400.
3. S. Cihangir, S. Kwan. Characterization of indium and solder bump bonding for pixel detectors, Nucl. Instr. and Meth. A 476 (2002) 670-675.
4. J. Breibach, K Lübelsmeyer, et al. Development of a bump bonding interconnect technology for GaAs pixel detectors, Nucl. Instr. and Meth. A 470 (2001) 576-582.
5. C. Gemme, A.M. Fiorello, et al. Study of indium bumps for ATLAS pixel detector, Nucl. Instr. and Meth. A 465 (2001) 200-203.
6. Ch. Broennimann, F. Glaus, et al. Development of an indium bump bond process for silicon pixel detectors at PSI, Nucl. Instr. and Meth. A 565 (2006) 303-308.
7. H. Honma, Plating technology for electronics packaging, Electrochimica Acta, 47 (2001) 75-84.
8. T. Ritzdorf, D. Fulton, in: M. Datta, T. Osaka, J.W. Schultze, Microelectronic packaging, CRC Press (2005).
9. P. Merken, J. John, et al. Technology for very dense hybrid detector arrays using electroplated indium solderbumps, IEEE Transactions on Advanced Packaging, Vol. 26, No. 1, Feb. 2003.
10. J. Jiang, S. Tsao, et al. Fabrication of indium bumps for hybrid infrared focal plane array applications, Infrared Physics & Technology, 45 (2004) 143-151.
11. M. Datta, Electrochemical processing techonlogies in chip fabrication: challenges and opportunities, Electrochimica Acta, 48 (2003) 2975-2985.
12. L.T. Romankiw. A path: from electroplating through lithographic masks in electronics to LIGA in MEMS, Electrochimica Acta, Vol. 42, pp. 2985-3005, 1997.
13. M. Datta, D. Landolt. Fundamental aspects and applications of electrochemical microfabrication, Electrochimica Acta, 45 (2000) 2535-2558.
14. Indium Sulfamate Plating Bath, Indium Corporation, Released in 2007.
15. T.J. Mason, J. P. Lorimer, Applied Sonochemistry, Wiley-VCH Verlag GmbH, Weinheim, (2002).
16. J.Cl.Puippe in: Jean-Claude Puippe, Frank Leaman, Theory and practice of pulse plating, American Electroplaters and Surface Finishers Soc., 1986 pp. 1-11.