Characterization of indium and solder bump bonding for pixel detectors

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 476, Issue 3, 2002, Pages 670-675

  Cihangir, S ^a   Kwan, S ^a  

^a FERMI NATIONAL ACCELERATOR LABORATORY   (United States)

Author keywords

Fine pitch solder bumps; Fluxless soldering; Indium bumps; Pixel detectors

Indexed keywords

BONDING; ELECTRIC RESISTANCE; INDIUM; OXIDATION; SPUTTERING;

PIXEL DETECTORS;

PARTICLE DETECTORS;

EID: 0037059417     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-9002(01)01771-5     Document Type: Conference Paper

References (2)

1. Proceedings of PIXEL'98
2. Fluxless no-clean assembly of solder bumped flip chips