Development of a bump bonding interconnect technology for GaAs pixel detectors

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 470, Issue 3, 2001, Pages 576-582

  Breibach, J ^a   Lubelsmeyer K ^a   Mäsing, Th ^a   Rente, C ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH ENERGY PHYSICS; PARTICLE BEAM TRACKING; SEMICONDUCTING GALLIUM ARSENIDE; SENSORS;

BUMP BONDING PROCESS; PIXEL DETECTORS;

RADIATION DETECTORS;

EID: 0035845693     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-9002(01)00785-9     Document Type: Article

References (15)

1. Thermal cycling test on solder joints of optoelectronic packaging with flip-chip bonding
2. Update on pixel hybridation
3. Flip-chip bump bonding reliability and process improvement
4. A micro flip chip process for high speed optoelectronic components