Special bump bonding technique for silicon pixel detectors

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 576, Issue 1, 2007, Pages 150-153

  Cabruja, Enric ^a   Bigas, Marc ^a   Ullan, Miguel ^a   Pellegrini, Giulio ^a   Lozano, Manuel ^a  

^a INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

Author keywords

Bump electroplating; Flipchip; High density packaging; Lead free bumps

Indexed keywords

ELECTRODEPOSITION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MEDICAL IMAGING; SILICON;

BUMP ELECTROPLATING; HIGH-DENSITY PACKAGING; LEAD-FREE BUMPS;

PARTICLE DETECTORS;

EID: 34248210708     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2007.01.143     Document Type: Article

References (16)

1. M. Miyata, Sn-Ag solder bump using 2-step plating process, in: Proceedings of the Fourth 2000 IEMT/IMC Symposium, 2000, pp. 122-127.
2. Z. S. Karim, R. Schetty, Lead-free bump interconnections for Flipchip applications, in: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2000, pp. 274-278.
3. P. Wölflick, K. Feldmann, Lead-free low-cost Flipchip process chain: layout, process, reliability, in: Proceedings of the IEEE International Electronics Manufacturing Technology (IEMT) Symposium, 2002, pp. 27-34.
4. M. McCormack, S. Jin, The design and properties of new, Pb-free solder alloys, in: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1994, pp. 7-14.
5. Laine-Ylijoki T., Steen H., and Forsten A. IEEE Trans. Compon. Pack. Manuf. Technol. 20 3 (1997) 194
6. Frear D.R., Jang J.W., Lin J.K., and Zhang C. J. Organomet. Chem. 53 6 (2001) 28
7. T. Akashi, Eutectic solder bumped Flipchip development, in: Proceedings of the 21st IEMT Symposium, 1997, pp. 319-325.
8. Jang S.Y., Wolf J., Ehrmann O., Gloor H., Reichl H., and Kyung-Wook P. IEEE Trans. Electron. Pack. Manuf. 25 4 (2002) 193
9. Ezawa H., Miyata M., Honma S., Inoue H., Tokuoka T., Yoshioka J., and Tsujimura M. IEEE Trans. Electron. Pack. Manuf. 24 4 (2001) 275
10. L. Sharon Pei-Siang, L. Chua Khoon, L.Charles, T. Poi-Siong, High density fine pitch Pb-free Flipchip interconect assembly, in: Proceedings of the Conference on Electronics Packaging Technology, 2003, pp. 275-281.
11. D. Shangguan and A. Achari, Evaluation of lead-free eutectic Sn-Ag solder for automotive electronics packaging applications, in: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1994, pp. 25-37.
12. Choi S., Lucas J.P., Subramanian K.N., and Bieler T.R. (2000), Kluwer Academic Publishers pp. 497-502
13. R. Kiumi, J. Yoshioka, F. Kuriyama, N. Saito, M. Shimoyama, Process development of electroplate bumping for ULSI flipchip minimum pitches comparison technology, in: Proceedings of the Conference on Electronic Components and Technology, 2002, pp. 711-716.
14. L. Li, R. Yang, L. Jong-Kai, Pb-free solder paste reflow window study for Flipchip wafer bumping, in: Proceedings of the International Symposium on Advanced Packaging Materials, March 2001, pp. 112-118.
15. Bigas M., and Cabruja E. Microelectron. J. (2005)
16. Lozano M., Cabruja E., Collado A., Santander J., and Ullán M. Nucl. Instr. and Meth. 473 (2001) 95