Nanoindentation analysis of mechanical properties of low to ultralow dielectric constant SiCOH films

Journal of Materials Research

Volumn 20, Issue 8, 2005, Pages 2080-2093

  Wang, Lugen ^a   Ganor, M ^a   Rokhlin, S I ^a   Grill, Alfred ^b  

^a OHIO STATE UNIVERSITY   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FINITE ELEMENT METHOD; HARDNESS; INDENTATION; MECHANICAL PROPERTIES; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POROSITY; SILICON; STIFFNESS; SUBSTRATES; THIN FILMS;

AMORPHOUS CARBON-DOPED; NANOINDENTATION ANALYSIS; SILICON SUBSTRATE;

AMORPHOUS MATERIALS;

EID: 28844500460     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0258     Document Type: Article

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