Missing solder ball failure mechanisms in plastic ball grid array packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 151-159

  Zhong, C H ^a   Yi, S ^b   Mui, Y C ^c   Howe, C P ^b   Olsen, D ^d   Chen, W T ^d  

^a Indira Gandhi Centre for Atomic Research   (India)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c ADVANCED MICRO DEVICES   (United States)

^d INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; DIFFUSION IN SOLIDS; FAILURE (MECHANICAL); FRACTURE; HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); INTERMETALLICS; MECHANICAL TESTING; METALLOGRAPHIC MICROSTRUCTURE; POROSITY; SHEAR STRENGTH; SOLDERING;

BALL PAD METALLURGY; MICROSTRUCTURE COARSENING; PLASTIC BALL GRID PACKAGES; SOLDER BALL; SOLDER BALL SHEAR TEST;

ELECTRONICS PACKAGING;

EID: 0034476628     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)