Testing interface thermal resistance

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 272-277

  Rencz, Marta ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON BEAM LITHOGRAPHY; ELECTRONICS PACKAGING; MATERIALS SCIENCE; TECHNOLOGICAL FORECASTING; TECHNOLOGY; THERMAL INSULATING MATERIALS; THROUGHPUT;

CHALLENGING PROBLEM; ELECTRONICS APPLICATIONS; EXPERIMENTAL TECHNIQUES; HIGH-THROUGHPUT METHODS; INDUSTRIAL METHODS; INTERFACE THERMAL RESISTANCE; MATERIAL DEVELOPMENTS; PACKAGING TECHNOLOGIES; RECENT TRENDS; STATE OF THE ARTS; THERMAL RESISTANCE;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50049134641     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469842     Document Type: Conference Paper

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