Increasing the accuracy of structure function based thermal material parameter measurements

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 1, 2005, Pages 51-57

  Rencz, Márta ^a   Poppe, András ^a   Kollár, Ernö ^b   Ress, Sándor ^b   Székely, Vladimir ^b  

^a MicReD Ltd   (Hungary)

^b BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

Interface thermal resistance measurement; Structure function evaluation; Thermal conductivity measurement; Thermal transient measurements

Indexed keywords

HEAT RESISTANCE; POLYNOMIALS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE STRUCTURES; THERMAL CONDUCTIVITY; THERMAL VARIABLES MEASUREMENT;

INTERFACE THERMAL RESISTANCE MEASUREMENT; STRUCTURE FUNCTION EVALUATION; THERMAL CONDUCTIVITY MEASUREMENT; THERMAL TRANSIENT MEASUREMENTS;

MICROELECTRONICS;

EID: 15744397800     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.843204     Document Type: Article

References (10)

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