Systematic evaluation of thermal interface materials-a case study in high power amplifier design

Microelectronics Reliability

Volumn 45, Issue 3-4, 2005, Pages 711-725

  Maguire, Luke ^a   Behnia, Masud ^a   Morrison, Graham ^a  

^a UNIVERSITY OF NEW SOUTH WALES   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ENERGY DISSIPATION; HEAT RESISTANCE; HEAT SINKS; INTERFACES (MATERIALS); THERMAL CONDUCTIVITY; VOLUME FRACTION;

JUNCTION TEMPERATURE; PHASE CHANGE MATERIALS (PCM); POWER TRANSISTORS; THERMAL INTERFACE MATERIALS (TIM);

POWER AMPLIFIERS;

EID: 15744366356     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.10.030     Document Type: Article

References (15)

1. International SEMATECH, International Technology Roadmap for Semiconductors, 2003
2. National Electronics Manufacturing Initiative, (NEMI) Technology Roadmap, 2002
3. Philips Semiconductors, Data Sheet: BLW96 HF/VHF power transistor, 1986. p. 1-14
4. J.P. Gwinn, and R.L. Webb Performance and testing of thermal interface materials Microelectron J 34 3 2003 215 222
5. W. Nakayama, and A.E. Bergles Thermal interfacing techniques for electronic equipment-a perspective Trans ASME 125 2003 192 199
6. D. Blazej Thermal interface materials Electron Cool 9 4 2003 14 20
7. C.J.M. Lasance Problems with thermal interface material measurements: suggestions for improvements Electron Cool 9 4 2003 22 29
8. Shih R, Bash CE. Dynamic characterization of thermal interface material for electronic cooling. In: Proceedings of the International Electronic Packaging Technical Conference and Exhibition, 2003, Maui, USA, Paper No. IPACK2003-35073
9. Gektin V, Ankireddi S, Jones J, Pecavar S, Hundt P. Characterizing bulk thermal conductivity and interface contact resistance effects of thermal interface materials in electronic cooling applications. In: Proceedings of the International Electronic Packaging Technical Conference and Exhibition, 2003, Maui, USA, Paper No. IPACK2003-35324
10. Maguire L, Behnia M, Morrison G. An experimental and computational study of heat transfer in high power amplifiers. Heat Transfer Engng, in press
11. Barkley K. Application note AN009: How to avoid getting burned by junction temperature, M/A-COM. p. 57-9
12. B.M. Guenin Calculations for thermal interface materials Electron Cool 9 3 2003 8 9
13. Y. Ito, J. Toyoda, and S. Nagata Interface pressure distribution in a bolt flange assembly J Mech Des 101 1979 330 337
14. S. Itoh, Y. Shiina, and Y. Ito Behavior of interface pressure distribution in a single bolt-flange assembly subjected to heat flux J Eng Ind 114 2 1992 231 236
15. R.S. Prasher, J. Shipley, S. Prstic, P. Koning, and J.-L. Wang Thermal resistance of particle laden polymeric thermal interface materials J Heat Transfer 125 2003 1170 1177