A scalable multi-functional thermal test chip family: Design and evaluation

Journal of Electronic Packaging

Volumn 123, Issue 4, 2001, Pages 323-330

  Benedek, Zs ^a   Courtois, B ^b   Farkas, G ^c   Kollar, E ^a   Mir, S ^b   Poppe, A ^c   Rencz, M ^c   Szekely V ^a   Torki, K ^b  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

^b TIMA LABORATORY   (France)

^c MicReD Ltd   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042907267     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1389846     Document Type: Article

References (14)

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