Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications

Microsystem Technologies

Volumn 14, Issue 9-11, 2008, Pages 1531-1536

  Haj Taieb, M ^a   Haseeb, A S M A ^a,c   Caulfield, J ^b   Bade, K ^a   Aktaa, J ^a   Hemker, K J ^b  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^b Johns Hopkins University   (United States)

^c UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL ANALYSIS; COMPOSITE MICROMECHANICS; COPPER PLATING; CORROSION; GRAIN GROWTH; HARDNESS; HIGH TEMPERATURE APPLICATIONS; HIGH TEMPERATURE TESTING; MATERIALS TESTING; MEMS; METALLIC COMPOUNDS; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; NICKEL ALLOYS; TENSILE TESTING; THERMODYNAMIC STABILITY;

AS-DEPOSITED; HARDNESS VALUES; HIGH TEMPERATURE MEMS; LIGA NICKEL; MICRO-HARDNESS; SMALL GRAINS; STABLE STRUCTURES; TENSILE TESTS; TESTING SAMPLES; THERMAL STABILITY;

NICKEL;

EID: 49949087615     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0536-5     Document Type: Conference Paper

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