Tensile strength of electrodeposited nanocrystalline Ni-W alloys with finely dispersed micrometer-sized array through-holes

Materials Science and Engineering: A

Volumn 448-451, Issue , 2007, Pages 833-835

  Yamasaki, Tohru ^a   Oda, Natsuko ^a   Matsuoka, Hiroyuki ^a   Fukami, Takeshi ^a  

^a UNIVERSITY OF HYOGO   (Japan)

Author keywords

Electrodeposition; Finely dispersed micrometer sized array through holes; Nanocrystalline materials; Ni W; Shear bands deformation; UV lithographic techniques

Indexed keywords

CRACKS; ELECTRODEPOSITION; ELONGATION; FRACTURE; NANOCRYSTALLINE ALLOYS; PHOTOLITHOGRAPHY; SHEAR BANDS; SHEAR DEFORMATION; TENSILE STRENGTH;

ELECTRODEPOSITED NANOCRYSTALLINE ALLOYS; NOMINAL TENSILE STRENGTH; SHEAR BANDS DEFORMATION; ULTRAVIOLET-LITHOGRAPHIC DEFORMATION;

NICKEL ALLOYS;

CRACKS; ELECTRODEPOSITION; ELONGATION; FRACTURE; NANOCRYSTALLINE ALLOYS; NICKEL ALLOYS; PHOTOLITHOGRAPHY; SHEAR BANDS; SHEAR DEFORMATION; TENSILE STRENGTH;

EID: 33847218573     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.02.410     Document Type: Article

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