HF-contact elements for testing and multi chip module applications

Microsystem Technologies

Volumn 12, Issue 10-11, 2006, Pages 1015-1019

  Spanier, G ^a   Slavcheva, E ^a   Mokwa, W ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INDUSTRY; ELECTRONICS PACKAGING; ELECTROPLATING; FINITE ELEMENT METHOD; INDUSTRIAL APPLICATIONS; MECHANICAL PROPERTIES; NATURAL FREQUENCIES;

MULTI CHIP MODULES; NICKEL-TUNGSTEN-ALLOYS; SEMICONDUCTOR INDUSTRY ASSOCIATION;

MICROELECTROMECHANICAL DEVICES;

EID: 33747608367     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0133-z     Document Type: Conference Paper

References (7)

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2. Fritz T, Griepentrog M, Mokwa W, Schnakenberg U (2003) Determination of Young's modulus of electroplated nickel. Electrochim Acta 48:3029-3035
3. Keil A, Merl W, Vinaricky E, Schröder KH, Weiser J (2002) Elektrische Kontakte, Werkstoffe und Anwendungen. Springer, Berlin Heidelberg New York, p 524
4. Krüger C (2003) PhD Thesis, Aachen University
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6. Krüger C, Lee IT, Mokwa W, Schnakenberg U (2004) NiW-micro springs for chip connection. In; Proceedings of the 17th IEEE international conference on micro electro mechanical systems, MEMS 2004, Maastricht, January 25-29, 2004, pp 117-120. ISBN 0-7803-8266-8
7. Semiconductor Industry Association (SIA) (1994) The national technology roadmap for semiconductors, San Jose, pp 63