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Volumn 50, Issue 28, 2005, Pages 5573-5580
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Electrodeposition and properties of NiW films for MEMS application
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Author keywords
Electrodeposition; MEMS; NiW
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Indexed keywords
COMPLEXATION;
CONCENTRATION (PROCESS);
ELECTROLYTES;
ELECTROPLATING;
MICROSTRUCTURE;
NICKEL COMPOUNDS;
PH EFFECTS;
INTERNAL STRESS;
MEMS;
NICKEL SULPHAMATE;
NIW;
METALLIC FILMS;
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EID: 24944501634
PISSN: 00134686
EISSN: None
Source Type: Journal
DOI: 10.1016/j.electacta.2005.03.059 Document Type: Article |
Times cited : (68)
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References (27)
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