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Volumn 51, Issue , 2008, Pages 297-299

An 11Gb/s inductive-coupling link with burst transmission

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC COUPLING; ENERGY EFFICIENCY;

EID: 49549087966     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2008.4523175     Document Type: Conference Paper
Times cited : (62)

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  • 2
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    • L. Luo, et al., "A 36Gb/s ACCI Multi-Channel Bus using a Fully Differential Pulse Receiver," Proc. CICC, pp. 773-776, Sept. 2006.
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  • 3
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    • 4Gbps High-Density AC Coupled Interconnection
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    • S. Mick, et al., "4Gbps High-Density AC Coupled Interconnection, " Proc. CICC, pp. 133-140, May 2002.
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  • 4
    • 28144453355 scopus 로고    scopus 로고
    • 3Gb/s AC-Coupled Chip-to-Chip Communication using a Low-Swing Pulse Receiver
    • Feb
    • L. Luo, et al., "3Gb/s AC-Coupled Chip-to-Chip Communication using a Low-Swing Pulse Receiver," ISSCC Dig. Tech. Papers, pp. 522-523, Feb. 2005.
    • (2005) ISSCC Dig. Tech. Papers , pp. 522-523
    • Luo, L.1
  • 5
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    • 3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities
    • Feb
    • A. Fazzi, et al., "3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities," ISSCC Dig. Tech. Papers, pp. 356-357, Feb. 2007.
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    • Fazzi, A.1
  • 6
  • 7
    • 33847145908 scopus 로고    scopus 로고
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    • Sept
    • A. Fazzi, et al., "A 0.14mW/Gbps High-Density Capacitive Interface for 3D System Integration," Proc. CICC, pp. 101-104, Sept. 2005.
    • (2005) Proc. CICC , pp. 101-104
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  • 8
    • 2442675160 scopus 로고    scopus 로고
    • Electronic Alignment for Proximity Communication
    • Feb
    • R. Drost, et al., "Electronic Alignment for Proximity Communication," ISSCC Dig. Tech. Papers, pp. 144-145, Feb. 2004.
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  • 9
    • 0242425326 scopus 로고    scopus 로고
    • A 1.27Gh/s/ch 3mW/pin Wireless Superconnect (WSC) Interface Scheme
    • Feb
    • K. Kanda, et al., "A 1.27Gh/s/ch 3mW/pin Wireless Superconnect (WSC) Interface Scheme," ISSCC Dig. Tech. Papers, pp. 186-187, Feb. 2003.
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  • 10
    • 34548860343 scopus 로고    scopus 로고
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    • Feb
    • N. Miura, et al., "A 0.14pJ/b Inductive-Coupling Inter-Chip Data Transceiver with Digitally-Controlled Precise Pulse Shaping," ISSCC Dig. Tech. Papers, pp. 358-359, Feb. 2007.
    • (2007) ISSCC Dig. Tech. Papers , pp. 358-359
    • Miura, N.1
  • 11
    • 33846207670 scopus 로고    scopus 로고
    • A 1Tb/s 3W Inductive-Coupling Transceiver for Inter-Chip Clock and Data Link
    • Feb
    • N. Miura, et al., "A 1Tb/s 3W Inductive-Coupling Transceiver for Inter-Chip Clock and Data Link," ISSCC Dig. Tech. Papers, pp. 424-425, Feb. 2006.
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  • 12
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    • Feb
    • N. Miura, et al., "A 195Gb/s 1.2W 3D-Stacked Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme," ISSCC Dig. Tech. Papers, pp. 264-265, Feb. 2005.
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  • 13
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  • 14
    • 0034428321 scopus 로고    scopus 로고
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    • A. Tanabe, et al., "A 10 Gb/s Demultiplexer IC in 0.18μm CMOS using Current Mode Logic with Tolerance to the Threshold Voltage Fluctuation," ISSCC Dig. Tech. Papers, pp. 62-63, Feb. 2000.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.