Electronic alignment for proximity communication

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn 47, Issue , 2004, Pages

  Drost, Robert ^a   Ho, Ron ^a   Hopkins, David ^a   Sutherland, Ivan ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMMUNICATION CIRCUITS; MICROPLATES; PARALLEL COMMUNICATION CIRCUITS;

CAPACITANCE; CAPACITORS; MULTIPLEXING; PARALLEL PROCESSING SYSTEMS; SWITCHING CIRCUITS; VIBRATIONS (MECHANICAL); WIRELESS TELECOMMUNICATION SYSTEMS;

MICROPROCESSOR CHIPS;

EID: 2442675160     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. R. Drost et al., "Proximity Communications," IEEE CICC, pp. 469-472, 2003.
2. S. Mick et al., "4Gbps High-Density AC Coupled Interconnection, " IEEE CICC, pp. 133-140, 2002.
3. D. Salzman et al., "Capacitively Coupled Multichip Modules," MCM Conference, pp. 487-494, April 1994.
4. K. Kanda et al., "1.27Gb/s/pin 3mW/pin Wireless Superconnect Interface Scheme," ISSCC Dig. Tech. Papers, pp. 186-187, Feb. 2003.