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Volumn , Issue , 2006, Pages 773-776

A 36Gb/s ACCI multi-channel bus using a fully differential pulse receiver

Author keywords

[No Author keywords available]

Indexed keywords

ACCI MULTI CHANNEL; INTERCONNECT LENGTHS;

EID: 34249798235     PISSN: 08865930     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CICC.2006.320976     Document Type: Conference Paper
Times cited : (9)

References (8)
  • 1
    • 0031104164 scopus 로고    scopus 로고
    • Capacitive Coupling and Quantized Feedback Applied to Conventional CMOS Technology
    • March
    • T. Gabara and W. Fischer, "Capacitive Coupling and Quantized Feedback Applied to Conventional CMOS Technology," IEEE J. Solid State Circuits, pp. 419-427, March 1997.
    • (1997) IEEE J. Solid State Circuits , pp. 419-427
    • Gabara, T.1    Fischer, W.2
  • 2
    • 0029205191 scopus 로고
    • Vertical signal transmission in three-dimensional integrated circuits by capacitive coupling
    • S. Kühn, et al., "Vertical signal transmission in three-dimensional integrated circuits by capacitive coupling," ISCAS '95, pp 37-40, 1995.
    • (1995) ISCAS '95 , pp. 37-40
    • Kühn, S.1
  • 3
    • 0242425326 scopus 로고    scopus 로고
    • 1.27Gb/s/pin 3mW/pin Wireless Superconnect (WSC) Interface Scheme
    • February
    • K. Kanda et al., "1.27Gb/s/pin 3mW/pin Wireless Superconnect (WSC) Interface Scheme," International Solid-State Circuits Conference, pp. 186-187, February 2003.
    • (2003) International Solid-State Circuits Conference , pp. 186-187
    • Kanda, K.1
  • 5
    • 31344445232 scopus 로고    scopus 로고
    • 3Gb/s AC coupled chip-to-chip Communication using a low swing pulse receiver
    • January
    • L. Luo, et al., "3Gb/s AC coupled chip-to-chip Communication using a low swing pulse receiver," IEEE J. Solid-State Circuits, pp. 287-296, January 2006.
    • (2006) IEEE J. Solid-State Circuits , pp. 287-296
    • Luo, L.1
  • 7
    • 33845594694 scopus 로고    scopus 로고
    • Fully Integrated AC Coupled Interconnect using Buried Bumps
    • Oct
    • J. Wilson, et al., "Fully Integrated AC Coupled Interconnect using Buried Bumps," IEEE Electrical Performance of Electronic Packaging, pp 7-10, Oct. 2005.
    • (2005) IEEE Electrical Performance of Electronic Packaging , pp. 7-10
    • Wilson, J.1
  • 8
    • 20444492457 scopus 로고    scopus 로고
    • A 5.6-mW 1-Gb/s/pair pulsed signaling transceiver for a fully AC coupled bus
    • June
    • J. Kim, I. Verbauwhede and F. Chang, "A 5.6-mW 1-Gb/s/pair pulsed signaling transceiver for a fully AC coupled bus," IEEE J. Solid-State Circuits, Vol. 40, pp. 1331-1340, June 2005.
    • (2005) IEEE J. Solid-State Circuits , vol.40 , pp. 1331-1340
    • Kim, J.1    Verbauwhede, I.2    Chang, F.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.