3D capacitive interconnections with mono- and Bi-directional capabilities

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn , Issue , 2007, Pages 356-358

  Fazzi, Alberto ^a   Canegallo, Roberto ^b   Ciccarelli, Luca ^b   Magagni, Luca ^a   Natali, Federico ^a   Jung, Erik ^c   Rolandi, Pier Luigi ^b   Guerrieri, Roberto ^a  

^a UNIVERSITY OF BOLOGNA   (Italy)

^b STMICROELECTRONICS   (Italy)

^c FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRODES; ENERGY UTILIZATION; INTERCONNECTION NETWORKS; MICROPROCESSOR CHIPS; THROUGHPUT;

3D SYSTEM INTEGRATION; DIRECTIONAL CAPABILITIES; PROPAGATION DELAY; RX-TX CIRCUITS;

WIRELESS NETWORKS;

EID: 34548847150     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2007.373441     Document Type: Conference Paper

References (10)

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