Stress-induced surface damages in Ti-Si-N films grown by magnetron sputtering

Thin Solid Films

Volumn 516, Issue 21, 2008, Pages 7609-7614

  Liu, Zong Jian ^a   Jiang, Ning ^b   Shen, Y G ^b   Li, Xiaonian ^a  

^a ZHEJIANG UNIVERSITY OF TECHNOLOGY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Buckling; Crack; Nitrides; Scanning electron microscopy; Sputtering; Thin films

Indexed keywords

MOLECULAR BEAM EPITAXY; SILICON; TITANIUM COMPOUNDS;

BUCKLING; CRACK; NITRIDES; SCANNING ELECTRON MICROSCOPY; SPUTTERING; STRESS-INDUCED; SURFACE DAMAGES; THIN FILMS; TI-SI-N;

MAGNETRON SPUTTERING;

EID: 49349095508     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.04.090     Document Type: Article

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