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Volumn 43, Issue 3, 2008, Pages 469-480
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Thermal performance of flip chip packages: Numerical study of thermo-mechanical interactions
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Author keywords
Couple field element; Finite element analysis; Flip chip package; Thermal mechanical analysis
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Indexed keywords
CONCRETE PAVEMENTS;
FLIP CHIP DEVICES;
FLOW INTERACTIONS;
GRADIENT METHODS;
INDUSTRIAL ENGINEERING;
MIXED CONVECTION;
NUMERICAL ANALYSIS;
STRESS CONCENTRATION;
STRESSES;
TEMPERATURE SENSORS;
THERMAL GRADIENTS;
THERMOANALYSIS;
THERMOELECTRICITY;
THREE DIMENSIONAL;
TWO DIMENSIONAL;
2-D MODELING;
COMBINED EFFECTS;
COUPLE-FIELD ELEMENT;
DEVICE FAILURES;
ELECTRONIC PACKAGING;
FINITE ELEMENT;
FINITE ELEMENT ANALYSIS;
FLIP CHIP PACKAGE;
FLIP-CHIP PACKAGING;
MANUFACTURING PROCESSES;
MECHANICAL INTERACTIONS;
NUMERICAL CODES;
NUMERICAL STUDIES;
PLANE STRAINS;
SOLDER INTER CONNECTIONS;
STRESS DISTRIBUTIONS;
STRESS PRO FILES;
TEMPERATURE GRADIENTS;
THERMAL PERFORMANCE;
THERMAL-MECHANICAL ANALYSIS;
THREE-DIMENSIONAL MODELING;
UNDERFILL;
UNIFORM TEMPERATURE;
WARPAGE;
FINITE ELEMENT METHOD;
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EID: 49349092303
PISSN: 09270256
EISSN: None
Source Type: Journal
DOI: 10.1016/j.commatsci.2007.12.008 Document Type: Article |
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Times cited : (19)
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References (15)
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