Improved underfill adhesion in flip-chip packages by means of ultraviolet light/ozone treatment

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 1, 2004, Pages 179-187

  Sham, Man Lung Ivan ^a   Kim, Jang Kyo ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Contact angle; Flip chip package; Interfacial adhesion; Soldermask; Underfill; UV ozone

Indexed keywords

ADHESION; AGING OF MATERIALS; BOND STRENGTH (MATERIALS); BONDING; CONTACT ANGLE; ELASTIC MODULI; INTERFACES (MATERIALS); MECHANICAL VARIABLES MEASUREMENT; PASSIVATION; SOLDERING ALLOYS; ULTRAVIOLET RADIATION; X RAY PHOTOELECTRON SPECTROSCOPY;

CONTACT ANGLE MEASUREMENT; FLIP CHIP PACKAGES; OZONE TREATMENT; SURFACE POLARITY; UNDERFILL ADHESION; WETTABILITY;

FLIP CHIP DEVICES;

EID: 2442484738     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.825452     Document Type: Article

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