Thermal study for flip chip on FR-4 boards

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 879-884

  Zhou, Tiao ^a   Hundt, Michael ^a   Villa, Claudio ^a   Bond, Robert ^a   Lao, Tom ^a  

^a STMicroelectronics USA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HEAT LOSSES; HEAT RESISTANCE; HEAT SINKS; NUMERICAL ANALYSIS; PRINTED CIRCUIT BOARDS;

THERMAL PATHS; UNDERFILL MATERIALS;

FLIP CHIP DEVICES;

EID: 0030654126     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)