Thermal performance comparison of chip-on-board, flip chip-on-board and standard TQFP package

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1998, Pages 161-168

  Iliev, Simeon K ^a  

^a VTC Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; HEAT RESISTANCE; SOLDERING;

FLIP CHIP ON BOARD (FCOB); WIRE BONDED CHIP ON BOARD (WB COB);

ELECTRONICS PACKAGING;

EID: 0031699068     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)