Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages

Journal of Applied Polymer Science

Volumn 96, Issue 1, 2005, Pages 175-182

  Sham, Man Lung ^a   Kim, Jang Kyo ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Curing of polymers; Flip chip package; Residual stresses; Rheology; Thermal properties

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; GLASS TRANSITION; POLYMERS; RESIDUAL STRESSES; RHEOLOGY; THERMAL EXPANSION; THERMOGRAVIMETRIC ANALYSIS; THERMOMECHANICAL TREATMENT; VISCOSITY;

BIMATERIAL STRIP BENDING EXPERIMENT (BMSB); COEFFICIENT OF THERMAL EXPANSION (CTE); CURING OF POLYMERS; THERMAL PROPERTIES;

RESINS;

POLYMER SCIENCE;

EID: 14644436379     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.21384     Document Type: Article

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