Evolution of residual stresses in modified epoxy resins for electronic packaging applications

Composites Part A: Applied Science and Manufacturing

Volumn 35, Issue 5, 2004, Pages 537-546

  Sham, Man Lung ^a   Kim, Jang Kyo ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

B. Cure behaviour; B. Residual internal stress; B. Thermomechanical; Bi material strip bending test; E. Thermosetting resin

Indexed keywords

COOLING; ELASTIC MODULI; EPOXY RESINS; FLIP CHIP DEVICES; HEATING; RESIDUAL STRESSES; SILICA; THERMAL EXPANSION; THERMODYNAMIC STABILITY; THERMOMECHANICAL TREATMENT;

BI-MATERIAL STRIP BENDING TEST; CURE BEHAVIOR; RESIDUAL/INTERNAL STRESS; THERMOMECHANICAL; THERMOSETTING RESIN;

COMPOSITE MATERIALS;

EID: 1842612557     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2004.01.002     Document Type: Article

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