Low-pressure metallorganic chemical vapor deposition of Fe 2O3 thin films on Si(100) using n-butylferrocene and oxygen

Journal of the Electrochemical Society

Volumn 155, Issue 9, 2008, Pages

  Singh, Manish K ^a   Yang, Yi ^a   Takoudis, Christos G ^a,b  

^a University of Illinois   (United States)

^b University of Illinois at Chicago   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

METALLORGANIC CHEMICAL VAPOR DEPOSITION; ORGANOMETALLICS;

CHEMICAL VAPORS;

LOW PRESSURE CHEMICAL VAPOR DEPOSITION;

EID: 49149097641     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2952812     Document Type: Article

References (48)

1. R. M. Cornell and U. Schwertmann, The Iron Oxides: Structure, Properties, Reactions, Occurrences and Uses, Wiley-VCH, Weinheim (2003).
2. E. T. Lee, G. E. Jang, and D. D. Lee, Yoop Hakhoechi YPHJAP 0372-7807, 36, 465 (1999).
3. S. -Y. Zhao, J. -F. Lu, W. -C. Zhang, P. -H. Wei and G. -Z. ChunYu, Huaxue Chuanganqi, 16, 112 (1996).
4. G. Sarov and V. Docheva, Bulg. J. Phys., 2, 356 (1975). 1742-6588
5. J. B. MacChesney, P. B. O'Connor, and M. V. Sullivan, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2408163, 118, 776 (1971).
6. J. M. Ralph, C. C. R. Rossignol, and J. T. Vaughey, U.S. Pat. 2005106447 (2005).
7. B. Mu and Y. Yang, Guisuanyan Xuebao KSYHA5 0454-5648, 34, 1151 (2006).
8. Y. Suzuki, R. B. van Dover, E. M. Gyorgy, J. M. Phillips, V. Korenivski, D. J. Werder, C. H. Chen, R. J. Felder, R. J. Cava, J. J. Krajewski, J. Appl. Phys. JAPIAU 0021-8979 10.1063/1.361844, 79, 5923 (1996).
9. J. Wang, J. B. Neaton, H. Zheng, V. Nagarajan, S. B. Ogale, B. Liu, D. Viehland, V. Vaithyanathan, D. G. Schlom, U. V. Waghmare, Science SCIEAS 0036-8075 10.1126/science.1080615, 299, 1719 (2003).
10. N. A. Spaldin and M. Fiebig, Science SCIEAS 0036-8075 10.1126/science.1113357, 309, 391 (2005).
11. G. B. Stringfellow, Organometallic Vapor-Phase Epitaxy: Theory and Practice, Academic Press, San Diego, CA (1999).
12. A. C. Rastogi, S. Dhara, and B. K. Das, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2048703, 142, 3148 (1995).
13. P. O'Brien, N. L. Pickett, and D. J. Otway, Chem. Vap. Deposition CVDEFX 0948-1907 10.1002/1521-3862(20021203)8:6<237::AID-CVDE237>3.0.CO;2-O, 8, 237 (2002).
14. C. Vahlas, B. Caussat, F. Senocq, W. L. Gladfelter, L. Aloui, and T. Moersch, Chem. Vap. Deposition CVDEFX 0948-1907 10.1002/cvde.200606513, 13, 123 (2007).
15. L. Henn-Lecordier, J. J. N. Kidder, and G. W. Rubloff, J. Vac. Sci. Technol. A JVTAD6 0734-2101 10.1116/1.1776180, 22, 1984 (2004).
16. D. R. Mason, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2132868, 123, 519 (1976).
17. T. Maruyama and Y. Shinyashiki, Thin Solid Films THSFAP 0040-6090 10.1016/S0040-6090(98)00999-7, 333, 203 (1998).
18. C. C. Chai, J. Peng, and B. P. Yan, Sens. Actuators B SABCEB 0925-4005 10.1016/S0925-4005(97)80014-7, 34, 412 (1996).
19. E. T. Lee, G. E. Jang, C. K. Kim, and D. H. Yoon, Sens. Actuators B SABCEB 0925-4005 10.1016/S0925-4005(01)00716-X, 77, 221 (2001).
20. F. Yubero, M. Ocana, A. Justo, L. Contreras, and A. R. Gonzalez-Elipe, J. Vac. Sci. Technol. A JVTAD6 0734-2101 10.1116/1.1286198, 18, 2244 (2000).
21. A. G. Gilbert and K. G. P. Sulzmann, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2401930, 121, 832 (1974).
22. S. Behrens, H. Bönnemann, N. Matoussevitch, E. Dinjus, H. Modrow, N. Palina, M. Frerichs, V. Kempter, W. Maus-Friedrichs, A. Heinemann, Z. Phys. Chem. ZPCFAX 0942-9352 10.1524/zpch.2006.220.1.3, 220, 3 (2006).
23. K. L. Hardee and A. J. Bard, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2132984, 123, 1024 (1976).
24. D. Barreca, G. A. Battiston, D. Berto, R. Gerbasi, and E. Tondello, Surf. Sci. Spectra SSSPEN 1055-5269 10.1116/11.20020302, 8, 240 (2001).
25. J. Cheng and Y. Zhang, Mater. Sci. Forum MSFOEP 0255-5476, 475-479, 3749 (2005).
26. K. Kuribayashi and R. Ueyama, Thin Solid Films THSFAP 0040-6090 10.1016/S0040-6090(96)09102-X, 295, 16 (1997).
27. T. Maruyama and T. Kanagawa, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1836697, 143, 1675 (1996).
28. E. Fujii, H. Torii, A. Tomozawa, R. Takayama, and T. Hirao, Jpn. J. Appl. Phys., Part 1 JAPNDE 0021-4922 10.1143/JJAP.34.1937, 34, 1937 (1995).
29. Y. -Y. Wang, Y. -Z. Jiang, J. -F. Gao, M. -F. Liu, and G. -Y. Meng, Wuji Huaxue Xuebao WHUXEO 1001-4861, 22, 1269 (2006).
30. S. Dhara, B. R. Awasthy, A. C. Rastogi, B. K. Das, N. V. Gelfond, N. E. Fedotova, A. F. Bykov, and I. K. Igumenov, J. Magn. Magn. Mater., 134, 29 (1994). 0304-8853
31. K. Shalini, G. N. Subbanna, S. Chandrasekaran, and S. A. Shivashankar, Thin Solid Films THSFAP 0040-6090 10.1016/S0040-6090(02)00903-3, 424, 56 (2003).
32. L. Ben-Dor, E. Fischbein, I. Felner, and Z. Kalman, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2133323, 124, 451 (1977).
33. M. Lie, H. Fjellvag, and A. Kjekshus, Thin Solid Films THSFAP 0040-6090 10.1016/j.tsf.2005.04.063, 488, 74 (2005).
34. C. Bedoya, G. G. Condorelli, G. Anastasi, A. Baeri, F. Scerra, I. L. Fragala, J. G. Lisoni, and D. Wouters, Chem. Mater. CMATEX 0897-4756 10.1021/cm049836h, 16, 3176 (2004).
35. G. Beech and R. M. Lintonbon, Thermochim. Acta THACAS 0040-6031 10.1016/0040-6031(71)80003-5, 3, 97 (1971).
36. S. Mathur, V. Sivakov, H. Shen, S. Barth, C. Cavelius, A. Nilsson, and P. Kuhn, Thin Solid Films THSFAP 0040-6090 10.1016/j.tsf.2005.07.249, 502, 88 (2006).
37. S. Park, S. Lim, and H. Choi, Chem. Mater. CMATEX 0897-4756 10.1021/cm0601990, 18, 5150 (2006).
38. C. Pflitsch, D. Viefhaus, U. Bergmann, V. Kravets, H. Nienhaus, and B. Atakan, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2205179, 153, C546 (2006).
39. N. V. Karyakin, M. S. Kozlova, M. S. Sheiman, G. P. Kamelova, and V. N. Larina, Zh. Fiz. Khim. ZFKHA9 0044-4537, 77, 1375 (2003).
40. M. A. Siddiqi and B. Atakan, J. Chem. Eng. Data JCEAAX 0021-9568 10.1021/je060002k, 51, 1092 (2006).
41. A. de Souza, A. Pires, and V. Soldi, J. Therm. Anal. Calorim., 70, 405 (2002). 1388-6150
42. S. Liu, P. Cool, L. Lu, E. Beyers, P. V. der Voort, E. F. Vansant, and M. Jiang, Microporous Mesoporous Mater., 79, 299 (2005). 1387-1811
43. V. A. Varnek, I. K. Igumenov, P. A. Stabnikov, and L. N. Mazalov, J. Struct. Chem., 42, 860 (2001). 0022-4766
44. S. Mathur, M. Veith, V. Sivakov, H. Shen, V. Huch, U. Hartmann, and H. -B. Gao, Chem. Vap. Deposition CVDEFX 0948-1907 10.1002/1521-3862(20021203)8: 6<277::AID-CVDE277>3.0.CO;2-8, 8, 277 (2002).
45. L. S. Darken and R. W. Gurry, J. Am. Chem. Soc. JACSAT 0002-7863 10.1021/ja01209a030, 68, 798 (1946).
46. L. M. Zhang, Y. S. Gong, C. B. Wang, Q. Shen, and M. X. Xia, Thin Solid Films THSFAP 0040-6090 10.1016/j.tsf.2005.09.076, 496, 371 (2006).
47. M. Aronniemi, J. Lahtinen, and P. Hautojärvi, Surf. Interface Anal. SIANDQ 0142-2421 10.1002/sia.1823, 36, 1004 (2004).
48. N. S. McIntyre and D. G. Zetaruk, Anal. Chem. ANCHAM 0003-2700 10.1021/ac50019a016, 49, 1521 (1977).