A study on the electrical resistance of solder joint interconnections

Microelectronic Engineering

Volumn 63, Issue 4, 2002, Pages 363-372

  Liu, De Shin ^a   Ni, Chin Yu ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

BGA package; Electrical resistance; Hybrid deformations; Solder joint interconnections

Indexed keywords

COMPUTER SIMULATION; DEFORMATION; ELECTRIC RESISTANCE; SOLDERED JOINTS; STRAIN; THERMAL EFFECTS;

BALL GRID ARRAYS (BGA);

ELECTRONICS PACKAGING;

EID: 0036722924     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00551-8     Document Type: Article

References (16)

1. A fracture mechanics approach to soldered joint cracking
2. Model I fracture toughness testing of eutectic Sn-Pb solder joints
3. The effect of substrate surface roughness on the fracture toughness of Cu/96.5Sn-3.5Ag solder joints
4. Fracture toughness of flip-chip encapsulants
5. Thermal fatigue behavior of low melting point solder joints
6. Creep of solder interconnections under combined loads
7. Linear finite element stress simulation of solder joints on 225 I/O plastic BGA package under thermal cycling
8. Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages
9. Reliability evaluations on a new tape ball grid array (TBGA)
10. Electrical resistance as an indicator of fatigue
11. Use of interconnect resistance as a reliability tool
12. An investigation of solder joint fatigue using electrical resistance spectroscopy